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FLIP-CHIP BONDING METHOD WITH MICRO-BUMP INTERCONNECTIONS FOR HYBRIDISED CHIP PRODUCTION
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Abstract
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FLIP-CHIP BONDING METHOD WITH MICRO-BUMP INTERCONNECTIONS FOR HYBRIDISED CHIP PRODUCTION
ORDINARY APPLICATION
Published
Filed on 5 June 2023
Patent Information
| Application ID | 202311038398 |
| Date of Application | 05/06/2023 |
Documents
| Name | Date |
|---|---|
| 202311038398-COMPLETE SPECIFICATION [05-06-2023(online)].pdf | 05/06/2023 |
| 202311038398-DECLARATION OF INVENTORSHIP (FORM 5) [05-06-2023(online)].pdf | 05/06/2023 |
| 202311038398-DRAWINGS [05-06-2023(online)].pdf | 05/06/2023 |
| 202311038398-EDUCATIONAL INSTITUTION(S) [05-06-2023(online)].pdf | 05/06/2023 |
| 202311038398-EVIDENCE FOR REGISTRATION UNDER SSI(FORM-28) [05-06-2023(online)].pdf | 05/06/2023 |
| 202311038398-FORM 1 [05-06-2023(online)].pdf | 05/06/2023 |
| 202311038398-FORM FOR SMALL ENTITY(FORM-28) [05-06-2023(online)].pdf | 05/06/2023 |
| 202311038398-FORM-9 [05-06-2023(online)].pdf | 05/06/2023 |
| 202311038398-OTHERS [05-06-2023(online)].pdf | 05/06/2023 |
| 202311038398-POWER OF AUTHORITY [05-06-2023(online)].pdf | 05/06/2023 |
