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FFT ANALYTICS UTILIZING VIBRATION DATA FROM HOT-MELT EXTRUDER MACHINE IN ADHESIVE TAPE MANUFACTURING UNIT VIA IOT TECHNOLOGY

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FFT ANALYTICS UTILIZING VIBRATION DATA FROM HOT-MELT EXTRUDER MACHINE IN ADHESIVE TAPE MANUFACTURING UNIT VIA IOT TECHNOLOGY

ORDINARY APPLICATION

Published

date

Filed on 17 November 2024

Abstract

A fft analytics utilizing vibration data from hot-melt extruder machine in adhesive tape manufacturing unit via iot technology comprises FAVDT_HMENode (100), which is outfitted with an Atmega128 MCU Board (108), a NuttyFi Wifi Module (101), a 3 Axis MEMS Vibration Sensor (106), an SD card (105), a display (107), an indicator (102), a buzzer (103), and a power supply (104), this is made possible by IoT technology and cloud-based analytics the vibration data collected from the Hot-Melt Extruder Machine is processed and organized locally by the Atmega128 MCU Board integrated into the FAVDT_HMENode, this allows the data to be transmitted to the cloud server for real-time analysis and monitoring in adhesive tape manufacturing units.

Patent Information

Application ID202411088868
Invention FieldPHYSICS
Date of Application17/11/2024
Publication Number48/2024

Inventors

NameAddressCountryNationality
DR. ALOK JAINLOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
VAIBHAV MITTALLOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
RISHI CHOPRALOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
MONICA GULATILOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
TARA SINGLALOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia
DR. SAWINDER KAUR VERMANILOVELY PROFESSIONAL UNIVERSITY, JALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia

Applicants

NameAddressCountryNationality
LOVELY PROFESSIONAL UNIVERSITYJALANDHAR-DELHI G.T. ROAD, PHAGWARA, PUNJAB-144 411, INDIA.IndiaIndia

Specification

Description:FIELD OF THE INVENTION
This invention relates to fft analytics utilizing vibration data from hot-melt extruder machine in adhesive tape manufacturing unit via iot technology.
BACKGROUND OF THE INVENTION
With the use of IoT technology and cloud-based analytics, this innovative system revolutionizes the way adhesive tape manufacturing facilities monitor and analyze their Hot-Melt Extruder Machines. Through an intuitive web interface, users can readily access this data, enabling preventative maintenance measures to maintain optimal machine performance, minimize downtime, and increase productivity throughout the manufacturing cycle.
The problem of enhancing the monitoring and analysis of Hot-Melt Extruder Machines in adhesive tape manufacturing facilities is the focus of this creative approach. Traditionally, the lack of real-time data monitoring capabilities and all-inclusive analytic tools has hindered operators' ability to proactively identify probable breakdowns and machine performance issues.
US10080721B2: The invention relates to a hot-melt extruded pharmaceutical dosage form with controlled release of a pharmacologically active ingredient embedded in a matrix comprising a polymer, the dosage form exhibiting a breaking strength of at least 300 N and having an oblong shape comprising a longitudinal direction of extension, a transversal direction of extension orthogonal to the longitudinal direction of extension, a front side, an opposite back side and a circumferential rim between said front and back side, wherein the core of the pharmaceutical dosage form has a morphological orientation caused by hot-melt extrusion that is substantially orthogonal to the longitudinal direction of extension of the dosage form; and/or the release per area of the pharmacologically active ingredient through the front side and the opposite back side is faster than the release through the circumferential rim.
RESEARCH GAP: IoT Technology based FFT analysis of vibration of Hot-Melt Extruder Machine within industrial environments is the novelty of the system.
CA2734646C: The present invention includes compositions and methods of making a modified release pharmaceutical formulation and a method of preparation for the embedding of modified release multi-particulates into a polymeric or wax-like matrix. The modified release multi-particulates comprise an effective amount of a therapeutic compound having a known or desired drug-release profile. Modified release multi-particulates may include a polymeric coat or may be incorporated into particle or core material. The polymer matrix comprises a thermoplastic polymer or lipophilic carrier or a mixture thereof that softens or melts at elevated temperature and allows the distribution of the modified release multi-particulates in the polymer matrix during thermal processing. Formulation compounds and processing conditions are selected in a manner to preserve the controlled release characteristics and/or drug-protective properties of the original modified release multi-particulates.
RESEARCH GAP: IoT Technology based FFT analysis of vibration of Hot-Melt Extruder Machine within industrial environments is the novelty of the system.
SUMMARY OF THE INVENTION
This summary is provided to introduce a selection of concepts, in a simplified format, that are further described in the detailed description of the invention.
This summary is neither intended to identify key or essential inventive concepts of the invention and nor is it intended for determining the scope of the invention.
To further clarify advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof, which is illustrated in the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. The invention will be described and explained with additional specificity and detail with the accompanying drawings.
This innovation uses cloud-based analysis, local processing, user-friendly interface design, and seamless data collection. Its core technology is the Internet of Things (IoT), which combines many hardware elements with cloud-based analytics to provide real-time actionable insights. The FAVDT_HMENode's hardware is meticulously chosen and put together for extensive data gathering and on-site processing. Operating as the central processing unit, the Atmega128 MCU Board controls all system functions. Wireless connectivity is made possible via the NuttyFi Wifi Module, allowing for smooth communication between the device and the chosen cloud server. The main component for data collecting is the 3 Axis MEMS Vibration Sensor, which records comprehensive information about the vibrations of the machine. Local data storage is ensured by the SD Card in the interim, providing redundancy and dependability. Furthermore, by giving real-time feedback and alerts, the addition of a Display, Indicator, and Buzzer improves user interaction.
BRIEF DESCRIPTION OF THE DRAWINGS
The illustrated embodiments of the subject matter will be understood by reference to the drawings, wherein like parts are designated by like numerals throughout. The following description is intended only by way of example, and simply illustrates certain selected embodiments of devices, systems, and methods that are consistent with the subject matter as claimed herein, wherein:
FIGURE 1: SYSTEM ARCHITECTURE
The figures depict embodiments of the present subject matter for the purposes of illustration only. A person skilled in the art will easily recognize from the following description that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the disclosure described herein.
DETAILED DESCRIPTION OF THE INVENTION
The detailed description of various exemplary embodiments of the disclosure is described herein with reference to the accompanying drawings. It should be noted that the embodiments are described herein in such details as to clearly communicate the disclosure. However, the amount of details provided herein is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the present disclosure as defined by the appended claims.
It is also to be understood that various arrangements may be devised that, although not explicitly described or shown herein, embody the principles of the present disclosure. Moreover, all statements herein reciting principles, aspects, and embodiments of the present disclosure, as well as specific examples, are intended to encompass equivalents thereof.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a"," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.
It should also be noted that in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may, in fact, be executed concurrently or may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
In addition, the descriptions of "first", "second", "third", and the like in the present invention are used for the purpose of description only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include at least one of the features, either explicitly or implicitly.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments belong. It will be further understood that terms, e.g., those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
This innovation uses cloud-based analysis, local processing, user-friendly interface design, and seamless data collection. Its core technology is the Internet of Things (IoT), which combines many hardware elements with cloud-based analytics to provide real-time actionable insights. The FAVDT_HMENode's hardware is meticulously chosen and put together for extensive data gathering and on-site processing. Operating as the central processing unit, the Atmega128 MCU Board controls all system functions. Wireless connectivity is made possible via the NuttyFi Wifi Module, allowing for smooth communication between the device and the chosen cloud server. The main component for data collecting is the 3 Axis MEMS Vibration Sensor, which records comprehensive information about the vibrations of the machine. Local data storage is ensured by the SD Card in the interim, providing redundancy and dependability. Furthermore, by giving real-time feedback and alerts, the addition of a Display, Indicator, and Buzzer improves user interaction.
The innovation works in the following ways: The Hot-Melt Extruder Machine's vibration data is continuously gathered by the 3 Axis MEMS Vibration Sensor, which records minute deviations that might provide information about the machine's performance and overall health. The Atmega128 MCU Board then processes this data locally, organizing and getting it ready for transmission. The processed data is safely transferred to the appropriate cloud server created especially for this use using the NuttyFi Wifi Module. After being received, the data is subjected to a thorough analysis using pre-established algorithms that are specifically designed to meet the demands of vibration monitoring in the production of adhesive tape. These algorithms provide a range of outputs, such as data analysis with critical alerts, FFT (fast fourier transform) analytics, trending data charts, and real-time data monitoring. These outputs provide insightful information about the machine's performance and enable the real-time identification of trends, anomalies, and possible problems.
Furthermore, the innovation's user interface component is essential in promoting user interaction and decision-making. In addition to being seen locally on the device's display, the outputs produced by the cloud server can also be viewed online via a personalized web dashboard. This dashboard provides operators with an easy-to-use interface for tracking machine performance, examining data patterns, and getting important notifications. Operators may monitor the health of their machines and take proactive steps to prevent downtime and maintain optimal performance by login into their accounts.
BEST METHOD OF WORKING
Real-time monitoring and analysis of the vibrations of Hot-Melt Extruder Machines in adhesive tape manufacturing units is made possible by the FAVDT_HMENode, which is outfitted with an Atmega128 MCU Board, a NuttyFi Wifi Module, a 3 Axis MEMS Vibration Sensor, an SD card, a display, an indicator, a buzzer, and a power supply. This is made possible by IoT technology and cloud-based analytics.
The vibration data collected from the Hot-Melt Extruder Machine is processed and organized locally by the Atmega128 MCU Board integrated into the FAVDT_HMENode. This allows the data to be transmitted to the cloud server for real-time analysis and monitoring in adhesive tape manufacturing units.
To enable wireless connectivity and enable smooth transmission of processed vibration data from the Atmega128 MCU Board to the customized cloud server for real-time analysis and monitoring of Hot-Melt Extruder Machine vibrations in adhesive tape manufacturing units, the NuttyFi Wifi Module is also integrated into the FAVDT_HMENode.
For real-time analysis and monitoring in adhesive tape manufacturing facilities, the Hot-Melt Extruder Machine's detailed vibration data is captured by the 3 Axis MEMS Vibration Sensor coupled to the FAVDT_HMENode. This sensor offers vital insights into the machine's operation and health.
ADVANTAGES OF THE INVENTION
1. Using IoT technology and cloud-based analytics, the FAVDT_HMENode serves as the primary hub for data collection and transmission, enabling real-time vibration monitoring and analysis of Hot-Melt Extruder Machines in adhesive tape manufacturing facilities.
2. Wireless connectivity is provided using the NuttyFi Wifi Module, allowing the Atmega128 MCU Board to seamlessly transmit processed vibration data to the dedicated cloud server. This makes it easier to analyze and track vibrations from Hot-Melt Extruder Machines in adhesive tape manufacturing facilities in real time.
3. The Atmega128 MCU Board is crucial in enabling the transfer of vibration data from Hot-Melt Extruder Machines to the cloud server. It is utilized for local processing and arranging vibration data. In sticky tape manufacturing facilities, this permits real-time examination and monitoring.
4. The 3 Axis MEMS Vibration Sensor is in charge of gathering complex vibration data from Hot-Melt Extruder Machines, providing vital information about the functionality and health of the machine. Within the manufacturing facilities for adhesive tape, this data can then be analyzed and monitored in real time.
, Claims:1. A fft analytics utilizing vibration data from hot-melt extruder machine in adhesive tape manufacturing unit via iot technology comprises FAVDT_HMENode (100), which is outfitted with an Atmega128 MCU Board (108), a NuttyFi Wifi Module (101), a 3 Axis MEMS Vibration Sensor (106), an SD card (105), a display (107), an indicator (102), a buzzer (103), and a power supply (104), this is made possible by IoT technology and cloud-based analytics.
2. The machine as claimed in claim 1, wherein the vibration data collected from the Hot-Melt Extruder Machine is processed and organized locally by the Atmega128 MCU Board integrated into the FAVDT_HMENode, this allows the data to be transmitted to the cloud server for real-time analysis and monitoring in adhesive tape manufacturing units.
3. The machine as claimed in claim 1, wherein to enable wireless connectivity and enable smooth transmission of processed vibration data from the Atmega128 MCU Board to the customized cloud server for real-time analysis and monitoring of Hot-Melt Extruder Machine vibrations in adhesive tape manufacturing units, the NuttyFi Wifi Module is also integrated into the FAVDT_HMENode.
4. The machine as claimed in claim 1, wherein for real-time analysis and monitoring in adhesive tape manufacturing facilities, the Hot-Melt Extruder Machine's detailed vibration data is captured by the 3 Axis MEMS Vibration Sensor coupled to the FAVDT_HMENode, this sensor offers vital insights into the machine's operation and health.

Documents

NameDate
202411088868-COMPLETE SPECIFICATION [17-11-2024(online)].pdf17/11/2024
202411088868-DECLARATION OF INVENTORSHIP (FORM 5) [17-11-2024(online)].pdf17/11/2024
202411088868-DRAWINGS [17-11-2024(online)].pdf17/11/2024
202411088868-EDUCATIONAL INSTITUTION(S) [17-11-2024(online)].pdf17/11/2024
202411088868-EVIDENCE FOR REGISTRATION UNDER SSI [17-11-2024(online)].pdf17/11/2024
202411088868-EVIDENCE FOR REGISTRATION UNDER SSI(FORM-28) [17-11-2024(online)].pdf17/11/2024
202411088868-FORM 1 [17-11-2024(online)].pdf17/11/2024
202411088868-FORM FOR SMALL ENTITY(FORM-28) [17-11-2024(online)].pdf17/11/2024
202411088868-FORM-9 [17-11-2024(online)].pdf17/11/2024
202411088868-POWER OF AUTHORITY [17-11-2024(online)].pdf17/11/2024
202411088868-REQUEST FOR EARLY PUBLICATION(FORM-9) [17-11-2024(online)].pdf17/11/2024

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