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ENCAPSULATED BUS CIRCUIT FOR FLUID HEATING SYSTEMS
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Abstract
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ENCAPSULATED BUS CIRCUIT FOR FLUID HEATING SYSTEMS
PCT NATIONAL PHASE APPLICATION
Published
Filed on 7 July 2023
Patent Information
| Application ID | 202317045900 |
| Date of Application | 07/07/2023 |
Documents
| Name | Date |
|---|---|
| 202317045900-FORM-26 [21-07-2023(online)].pdf | 21/07/2023 |
| 202317045900-COMPLETE SPECIFICATION [07-07-2023(online)].pdf | 07/07/2023 |
| 202317045900-DECLARATION OF INVENTORSHIP (FORM 5) [07-07-2023(online)].pdf | 07/07/2023 |
| 202317045900-DRAWINGS [07-07-2023(online)].pdf | 07/07/2023 |
| 202317045900-FORM 1 [07-07-2023(online)].pdf | 07/07/2023 |
| 202317045900-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [07-07-2023(online)].pdf | 07/07/2023 |
| 202317045900-PRIORITY DOCUMENTS [07-07-2023(online)].pdf | 07/07/2023 |
| 202317045900-PROOF OF RIGHT [07-07-2023(online)].pdf | 07/07/2023 |
