ELECTROPLATING APPARATUS

Abstract

Disclosed in the present invention is an electroplating apparatus, comprising: a film frame, the center of which is provided with a through hole; a conveying branch pipe extending from a side wall of the film frame through hole to the edge of the film frame; an electroplating solution buffer structure, comprising a central cap and a flow stabilizing sleeve, the central cap being fixed on the film frame through hole and covering same, a plurality of first holes being formed in the top of the central cap, the flow stabilizing sleeve being fixed below the central cap and inserted into the film frame through hole, and at least one second hole being formed in a side wall of the flow stabilizing sleeve; and a diffusion plate being fixed to the top of the film frame and provided with a plurality of third holes. A cathode electroplating solution flows into a space between the flow stabilizing sleeve and the side wall of the film frame through hole via the conveying branch pipe, then enters the interior of the flow stabilizing sleeve through the second hole formed in the side wall of the flow stabilizing sleeve, and then is supplied to the diffusion plate through the first holes in the central cap and arrives at a substrate through the third holes. The present invention can buffer the flow velocity of a fluid, thus effectively solving the problem of differentiation between the center and the edge of a substrate to be electroplated, and improving the quality of an electroplated product.

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