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Electronic Component Enclosure and Method of Assembling the Electronic Component Enclosure
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Abstract
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Inventors
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Specification
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Electronic Component Enclosure and Method of Assembling the Electronic Component Enclosure
ORDINARY APPLICATION
Published
Filed on 18 May 2022
Patent Information
| Application ID | 202241028675 |
| Date of Application | 18/05/2022 |
Documents
| Name | Date |
|---|---|
| 202241028675-FORM 3 [12-03-2023(online)].pdf | 12/03/2023 |
| 202241028675-COMPLETE SPECIFICATION [18-05-2022(online)].pdf | 18/05/2022 |
| 202241028675-DECLARATION OF INVENTORSHIP (FORM 5) [18-05-2022(online)].pdf | 18/05/2022 |
| 202241028675-DRAWINGS [18-05-2022(online)].pdf | 18/05/2022 |
| 202241028675-FIGURE OF ABSTRACT [18-05-2022(online)].jpg | 18/05/2022 |
| 202241028675-FORM 1 [18-05-2022(online)].pdf | 18/05/2022 |
| 202241028675-FORM 18 [18-05-2022(online)].pdf | 18/05/2022 |
| 202241028675-POWER OF AUTHORITY [18-05-2022(online)].pdf | 18/05/2022 |
| 202241028675-PROOF OF RIGHT [18-05-2022(online)].pdf | 18/05/2022 |
| 202241028675-REQUEST FOR EXAMINATION (FORM-18) [18-05-2022(online)].pdf | 18/05/2022 |
