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ELECTROFORM VAPOR CHAMBER INTEGRATED THERMAL MODULE INTO PCB LAYOUT DESIGN
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Abstract
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ELECTROFORM VAPOR CHAMBER INTEGRATED THERMAL MODULE INTO PCB LAYOUT DESIGN
PCT NATIONAL PHASE APPLICATION
Published
Filed on 10 December 2020
Patent Information
| Application ID | 202047053851 |
| Date of Application | 10/12/2020 |
Documents
| Name | Date |
|---|---|
| 202047053851.pdf | 18/10/2021 |
| 202047053851-FORM 3 [16-06-2021(online)].pdf | 16/06/2021 |
| 202047053851-Proof of Right [28-01-2021(online)].pdf | 28/01/2021 |
| 202047053851-FORM 3 [25-01-2021(online)].pdf | 25/01/2021 |
| 202047053851-COMPLETE SPECIFICATION [10-12-2020(online)].pdf | 10/12/2020 |
| 202047053851-DECLARATION OF INVENTORSHIP (FORM 5) [10-12-2020(online)].pdf | 10/12/2020 |
| 202047053851-DRAWINGS [10-12-2020(online)].pdf | 10/12/2020 |
| 202047053851-FORM 1 [10-12-2020(online)].pdf | 10/12/2020 |
| 202047053851-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105) [10-12-2020(online)].pdf | 10/12/2020 |
| 202047053851-POWER OF AUTHORITY [10-12-2020(online)].pdf | 10/12/2020 |
