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ELECTROCONDUCTIVE PASTE AND CURED PRODUCT

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ELECTROCONDUCTIVE PASTE AND CURED PRODUCT

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 6 November 2024

Abstract

The present disclosure relates to an electroconductive paste containing components (A) through (C). Component (A) is an epoxy resin, component (B) is a latent curing agent, and component (C) is a plate-like crystalline metal powder having an average grain size of 0.6 to 1.4 µm. The present invention provides an electroconductive paste that is capable of producing a balance between the conductivity and the adhesive strength of the resulting cured product.

Patent Information

Application ID202447085003
Invention FieldELECTRICAL
Date of Application06/11/2024
Publication Number46/2024

Inventors

NameAddressCountryNationality
ENDO, Satoruc/o THREEBOND CO., LTD., 4-3-3 Minamiosawa, Hachioji-shi, Tokyo 1920398JapanJapan
SUZUKI, Takashic/o THREEBOND CO., LTD., 4-3-3 Minamiosawa, Hachioji-shi, Tokyo 1920398JapanJapan

Applicants

NameAddressCountryNationality
THREEBOND CO., LTD.4-3-3 Minamiosawa, Hachioji-shi, Tokyo 1920398JapanJapan

Documents

NameDate
202447085003-FORM 3 [13-12-2024(online)].pdf13/12/2024
202447085003-FORM-26 [07-11-2024(online)].pdf07/11/2024
202447085003-COMPLETE SPECIFICATION [06-11-2024(online)].pdf06/11/2024
202447085003-DECLARATION OF INVENTORSHIP (FORM 5) [06-11-2024(online)].pdf06/11/2024
202447085003-FORM 1 [06-11-2024(online)].pdf06/11/2024
202447085003-FORM 18 [06-11-2024(online)].pdf06/11/2024
202447085003-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [06-11-2024(online)].pdf06/11/2024
202447085003-PRIORITY DOCUMENTS [06-11-2024(online)].pdf06/11/2024
202447085003-PROOF OF RIGHT [06-11-2024(online)].pdf06/11/2024
202447085003-REQUEST FOR EXAMINATION (FORM-18) [06-11-2024(online)].pdf06/11/2024

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