ELECTRICALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF

Abstract

According to the present disclosure, provided is an electrically conductive resin composition which exhibits excellent storage stability and yields a cured product having low connection resistance. The present disclosure relates to an electrically conductive resin composition which contains components (A) to (E) and in which the organic solvent content is 1 mass% or less relative to the overall electrically conductive resin composition. Component (A): an epoxy resin having two or more epoxy groups per molecule. Component (B): a reactive diluent having one epoxy group per molecule. Component (C): rubber particles. Component (D): electrically conductive particles containing (d-1) and (d-2). (d-1): plate-type silver particles. (d-2): electrically conductive particles other than plate-type silver particles. Component (E): an epoxy curing agent.

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