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ELECTRICAL CONTACT FOR SEMICONDUCTOR PACKAGE

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ELECTRICAL CONTACT FOR SEMICONDUCTOR PACKAGE

CONVENTIONAL APPLICATION

Published

date

Filed on 6 September 2021

Patent Information

Application ID202114040384
Date of Application06/09/2021

Documents

NameDate
202114040384-ABSTRACT [17-05-2023(online)].pdf17/05/2023
202114040384-CLAIMS [17-05-2023(online)].pdf17/05/2023
202114040384-COMPLETE SPECIFICATION [17-05-2023(online)].pdf17/05/2023
202114040384-FER_SER_REPLY [17-05-2023(online)].pdf17/05/2023
202114040384-FORM-26 [17-05-2023(online)].pdf17/05/2023
202114040384-FORM 3 [14-04-2023(online)].pdf14/04/2023
202114040384-FER.pdf27/12/2022
202114040384-FORM 3 [13-10-2022(online)].pdf13/10/2022
202114040384-FORM 18 [16-09-2022(online)].pdf16/09/2022
202114040384-Covering Letter [14-04-2022(online)].pdf14/04/2022
202114040384-FORM 3 [14-04-2022(online)].pdf14/04/2022
202114040384-PETITION u-r 6(6) [14-04-2022(online)].pdf14/04/2022
20211404384-Correspondence-200122.pdf11/02/2022
20211404384-GPA-200122.pdf11/02/2022
202114040384-FORM-26 [08-12-2021(online)].pdf08/12/2021
202114040384-COMPLETE SPECIFICATION [06-09-2021(online)].pdf06/09/2021
202114040384-DECLARATION OF INVENTORSHIP (FORM 5) [06-09-2021(online)].pdf06/09/2021
202114040384-DRAWINGS [06-09-2021(online)].pdf06/09/2021
202114040384-EP 20195996-DASCODE-4EBE [06-09-2021].pdf06/09/2021
202114040384-FORM 1 [06-09-2021(online)].pdf06/09/2021
202114040384-STATEMENT OF UNDERTAKING (FORM 3) [06-09-2021(online)].pdf06/09/2021
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