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DIVCON MICROCHANNELS HEAT SINK FOR ELECTRONIC CHIP COOLING
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Abstract
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DIVCON MICROCHANNELS HEAT SINK FOR ELECTRONIC CHIP COOLING
ORDINARY APPLICATION
Published
Filed on 6 August 2015
Patent Information
| Application ID | 2972/MUM/2015 |
| Date of Application | 06/08/2015 |
Documents
| Name | Date |
|---|---|
| 2972-MUM-2015-FER.pdf | 30/08/2019 |
| 2972-MUM-2015-Form 1-060815.pdf | 11/08/2018 |
| 2972-MUM-2015-Form 18-060815.pdf | 11/08/2018 |
| 2972-MUM-2015-Form 2(Title Page)-060815.pdf | 11/08/2018 |
| 2972-MUM-2015-Form 3-060815.pdf | 11/08/2018 |
| 2972-MUM-2015-Form 5-060815.pdf | 11/08/2018 |
| 2972-MUM-2015-Form 9-060815.pdf | 11/08/2018 |
| 2972-MUM-2015-Other Patent Document-060815.pdf | 11/08/2018 |
| ABSTRACT1.jpg | 11/08/2018 |
