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DESIGN & ANALYSIS OF MICRO CHANNEL HEAT SINK FOR HIGH POWER DENSITY APPLICATIONS
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DESIGN & ANALYSIS OF MICRO CHANNEL HEAT SINK FOR HIGH POWER DENSITY APPLICATIONS
ORDINARY APPLICATION
Published
Filed on 26 July 2023
Patent Information
| Application ID | 202341050357 |
| Date of Application | 26/07/2023 |
Documents
| Name | Date |
|---|---|
| 202341050357-Approval Document-260723.pdf | 20/09/2023 |
| 202341050357-Form 1-260723.pdf | 20/09/2023 |
| 202341050357-Form 2(Title Page)-260723.pdf | 20/09/2023 |
| 202341050357-Form 9-260723.pdf | 20/09/2023 |
