CC2500 RF-BASED HYDRAULIC PRESSURE MONITORING FOR HYDRAULIC RAM EXTRUSION IN DIE MANUFACTURING PLANTS WITH CRITICAL ALERTS

Abstract

CC2500 RF-based hydraulic pressure monitoring for hydraulic ram extrusion in die manufacturing plants with critical alerts comprises TCRFHP_HRENode (10), which is outfitted with an ATmega64 MCU Board (60), CC2500 RF Module (50), Liquid Pressure Sensor (40), Temperature Sensor (30), and Power Supply (20), this allows for smooth transmission of the data to the central monitoring system for advanced analytics and remote operator access the TCRFHP_HRENode transmits sensor data to the RCRFHP_HRENode, which uses wireless communication and cloud technology to enable real-time monitoring, analytics, and presentation of critical alerts and trend analyses through an HMI Display and a customized web dashboard for operators in die manufacturing plants, the RCRFHP_HRENode is equipped with an ATmega64 MCU Board, CC2500 RF Module, ESP01 Wifi Board, HMI Display, and Power Supply.

Specification

Description:FIELD OF THE INVENTION
This invention relates to cc2500 rf-based hydraulic pressure monitoring for hydraulic ram extrusion in die manufacturing plants with critical alerts.
BACKGROUND OF THE INVENTION
A key component of increasing operational efficiency and ensuring the reliability of hydraulic systems is this cutting-edge hydraulic pressure monitoring system created for die production facilities. The technology achieves a thorough grasp of the condition of the hydraulic rams during extrusion processes by means of the smooth gathering of real-time data from liquid pressure and temperature sensors. By integrating advanced communication technologies, cloud-based analytics, and a personalized machine learning algorithm, operators may now access an intuitive web dashboard from a distance. In order to help operators make educated decisions and proactively handle possible problems, this dashboard provides crucial alerts, trend analysis, and actionable information.
The die manufacturing industry is now facing challenges in putting hydraulic pressure monitoring into practice, which could lead to production disruptions and increased maintenance costs. The lack of an advanced system makes it more difficult for operators to identify and address problems in a timely manner by providing them with a lack of real-time insights into the hydraulic ram extrusion processes. This restriction makes it more difficult to carry out preventative maintenance, which increases the risk of unplanned downtime.
CN107027297A: The shear of the extruder using cylinder or by electronic with the boosting mechanism to supplement the propulsive force equivalent to hydraulic coupling is provided. Extruder is made up of the fixed part of pushing against mold the boosting mechanism using lever, and by the way that shearing guide is pushed and fixing mould in a pressing direction to Horseshoe component, and the gap of the preceding surface of mould and shear knife can be remained necessarily, also, the boosting mechanism used with mechanism using lever that fascinates of shearing guide.
RESEARCH GAP: Wireless Hydraulic pressure monitoring innovation using CC2500 RF and Cloud for Hydraulic Ram Extrusion in Die Manufacturing Plant is the novelty of the system.
CN111618113A: The invention discloses an extruder, comprising: the device comprises a front beam and a rear beam which are fixedly connected through a fixed cross beam, a middle plate device driven by a hydraulic cylinder assembly, an extrusion cylinder device driven by a transfer oil cylinder, and a discard shearing device arranged between the front beam and the extrusion cylinder device. The middle plate device and the extrusion cylinder device are arranged between the front beam and the rear beam and are in sliding connection with the fixed cross beam. The extrusion cylinder device is provided with an extrusion cavity, and a mold cavity is arranged at the position of the front beam corresponding to the extrusion cavity. The middle plate device comprises an extrusion rod and a translation oil cylinder, the extrusion rod is arranged forwards and is arranged in a sliding mode in the middle plate device, the translation oil cylinder is fixedly installed on the middle plate device, and the extrusion rod is connected with the translation oil cylinder. According to the invention, the extrusion rod transversely moves to avoid the feeding position, so that the stroke and the cycle time of the extrusion rod are greatly shortened, and the efficient and automatic extrusion processing of the bar is realized. The invention can be applied to the field of bar extrusion processing.
RESEARCH GAP: Wireless Hydraulic pressure monitoring innovation using CC2500 RF and Cloud for Hydraulic Ram Extrusion in Die Manufacturing Plant is the novelty of the system.
SUMMARY OF THE INVENTION
This summary is provided to introduce a selection of concepts, in a simplified format, that are further described in the detailed description of the invention.
This summary is neither intended to identify key or essential inventive concepts of the invention and nor is it intended for determining the scope of the invention.
To further clarify advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof, which is illustrated in the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. The invention will be described and explained with additional specificity and detail with the accompanying drawings.
The cutting-edge two-node architecture used in die manufacturing facilities' hydraulic pressure monitoring system is called TCRFHP_HRENode and RCRFHP_HRENode. An ATmega64 MCU Board, CC2500 RF Module, Liquid Pressure Sensor, Temperature Sensor, and Power Supply make up the TCRFHP_HRENode. Its primary job is to collect pressure and temperature values in real time from the hydraulic system. After local processing, these sensor readings are sent via the CC2500 RF Module to the RCRFHP_HRENode. The transmitted data from the TCRFHP_HRENode is received by the RCRFHP_HRENode, which functions as the central hub. The ATmega64 MCU Board, ESP01 WiFi Board, CC2500 RF Module, HMI Display, and Power Supply are all included in its setup. The RCRFHP_HRENode uses the ESP01 Wifi Board to establish a connection with the dedicated cloud server for this invention after receiving sensor data. Using cloud technology makes it easier to store and analyze the data that has been gathered centrally.
BRIEF DESCRIPTION OF THE DRAWINGS
The illustrated embodiments of the subject matter will be understood by reference to the drawings, wherein like parts are designated by like numerals throughout. The following description is intended only by way of example, and simply illustrates certain selected embodiments of devices, systems, and methods that are consistent with the subject matter as claimed herein, wherein:
FIGURE 1: SYSTEM ARCHITECTURE
The figures depict embodiments of the present subject matter for the purposes of illustration only. A person skilled in the art will easily recognize from the following description that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the disclosure described herein.
DETAILED DESCRIPTION OF THE INVENTION
The detailed description of various exemplary embodiments of the disclosure is described herein with reference to the accompanying drawings. It should be noted that the embodiments are described herein in such details as to clearly communicate the disclosure. However, the amount of details provided herein is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the present disclosure as defined by the appended claims.
It is also to be understood that various arrangements may be devised that, although not explicitly described or shown herein, embody the principles of the present disclosure. Moreover, all statements herein reciting principles, aspects, and embodiments of the present disclosure, as well as specific examples, are intended to encompass equivalents thereof.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a"," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.
It should also be noted that in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may, in fact, be executed concurrently or may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
In addition, the descriptions of "first", "second", "third", and the like in the present invention are used for the purpose of description only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include at least one of the features, either explicitly or implicitly.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments belong. It will be further understood that terms, e.g., those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The cutting-edge two-node architecture used in die manufacturing facilities' hydraulic pressure monitoring system is called TCRFHP_HRENode and RCRFHP_HRENode. An ATmega64 MCU Board, CC2500 RF Module, Liquid Pressure Sensor, Temperature Sensor, and Power Supply make up the TCRFHP_HRENode. Its primary job is to collect pressure and temperature values in real time from the hydraulic system. After local processing, these sensor readings are sent via the CC2500 RF Module to the RCRFHP_HRENode. The transmitted data from the TCRFHP_HRENode is received by the RCRFHP_HRENode, which functions as the central hub. The ATmega64 MCU Board, ESP01 WiFi Board, CC2500 RF Module, HMI Display, and Power Supply are all included in its setup. The RCRFHP_HRENode uses the ESP01 Wifi Board to establish a connection with the dedicated cloud server for this invention after receiving sensor data. Using cloud technology makes it easier to store and analyze the data that has been gathered centrally.
A bespoke machine learning (ML) algorithm and Fast Fourier Transform (FFT) analysis are used inside the cloud server to examine the sensor data over time. Patterns, trends, and possible problems pertaining to hydraulic pressure in the die production process can be found using this analytical method. A customized web dashboard and a Human Machine Interface (HMI) Display are used to display the analysis's results. Real-time information is provided via the HMI Display, which also includes analytics-based recommendations, crucial alerts, and trending data charts. In addition, the customized online dashboard provides an intuitive user interface that operators can access via their personal accounts. Operators can monitor the hydraulic pressure conditions in the die making plant remotely from any location thanks to this accessibility.
BEST METHOD OF WOKING
Real-time liquid pressure and temperature data in the hydraulic ram extrusion processes are collected by the TCRFHP_HRENode, which is outfitted with an ATmega64 MCU Board, CC2500 RF Module, Liquid Pressure Sensor, Temperature Sensor, and Power Supply. This allows for smooth transmission of the data to the central monitoring system for advanced analytics and remote operator access.
The TCRFHP_HRENode transmits sensor data to the RCRFHP_HRENode, which uses wireless communication and cloud technology to enable real-time monitoring, analytics, and presentation of critical alerts and trend analyses through an HMI Display and a customized web dashboard for operators in die manufacturing plants. The RCRFHP_HRENode is equipped with an ATmega64 MCU Board, CC2500 RF Module, ESP01 Wifi Board, HMI Display, and Power Supply.
The processing unit of the hydraulic pressure monitoring system for die manufacturing plants is the ATmega64 MCU Board, which is integrated into both of the motes. It performs local data processing tasks and enables smooth communication between sensors, RF modules, and other components.
The TCRFHP_HRENode and RCRFHP_HRENode can reliably communicate wirelessly thanks to the CC2500 RF Module, which is also included in both of the motes. This allows real-time sensor data to be transmitted, which is crucial for hydraulic pressure monitoring in die manufacturing facilities.
To accurately monitor the extrusion processes in die production plants, the Liquid Pressure Sensor coupled to the TCRFHP_HRENode is utilized to measure and provide real-time data on hydraulic pressure.
The Temperature Sensor, which is likewise connected to the TCRFHP_HRENode, is utilized to supply temperature data in real time, facilitating thorough environmental condition monitoring and aiding in the evaluation of hydraulic ram extrusion procedures in die production facilities as a whole.
The RCRFHP_HRENode's integrated ESP01 WiFi Board is used to enable smooth connectivity to the cloud server, allowing the transfer of processed sensor data and supporting real-time analytics, monitoring, and trend analysis display via an HMI Display and a customized web dashboard for die manufacturing plant operators.
To improve situational awareness in die production facilities, the HMI Display interfaced on RCRFHP_HRENode is utilized to give operators real-time visualizations, critical alerts, and trend analysis obtained from the hydraulic pressure monitoring system.
ADVANTAGES OF THE INVENTION
1. During hydraulic ram extrusion procedures, the TCRFHP_HRENode serves as the main data acquisition device, collecting data on liquid pressure and temperature in real time. This device enables smooth data transfer to the central monitoring system enabling operator access from a distance and enhanced analytics.
2. The TCRFHP_HRENode transmits sensor data to the RCRFHP_HRENode, which acts as the hub. It makes use of cloud computing and wireless connection to facilitate real-time analytics, trend analysis, and the presentation of important notifications. In die production operations, operators can obtain this data via a customized online dashboard and an HMI Display.
3. The CC2500 RF Module is essential to the TCRFHP_HRENode and RCRFHP_HRENode's ability to establish dependable wireless connectivity. The transfer of crucial real-time sensor data is made easier by this module, providing hydraulic pressure monitoring in die manufacturing facilities.
4. The TCRFHP_HRENode's embedded Liquid Pressure Sensor is essential for accurately measuring and delivering hydraulic pressure data in real time. This contribution guarantees precise extrusion process monitoring in die manufacturing facilities.
5. The RCRFHP_HRENode's ESP01 Wifi Board allows for smooth communication with the cloud server. It makes it easier for processed sensor data to be transferred, enabling real-time analytics, monitoring, and trend analysis display for operators in die production operations via an HMI Display and a customized online dashboard.
6. The RCRFHP_HRENode's HMI Display serves as the user interface, providing operators with trend analysis, critical alerts, and real-time visualizations from the hydraulic pressure monitoring system. In die manufacturing facilities, this improves situational awareness.
, Claims:1. A system of CC2500 RF-based hydraulic pressure monitoring for hydraulic ram extrusion in die manufacturing plants with critical alerts comprises TCRFHP_HRENode (10), which is outfitted with an ATmega64 MCU Board (60), CC2500 RF Module (50), Liquid Pressure Sensor (40), Temperature Sensor (30), and Power Supply (20), this allows for smooth transmission of the data to the central monitoring system for advanced analytics and remote operator access.
2. The system as claimed in claim 1, wherein the TCRFHP_HRENode transmits sensor data to the RCRFHP_HRENode, which uses wireless communication and cloud technology to enable real-time monitoring, analytics, and presentation of critical alerts and trend analyses through an HMI Display and a customized web dashboard for operators in die manufacturing plants, the RCRFHP_HRENode is equipped with an ATmega64 MCU Board, CC2500 RF Module, ESP01 Wifi Board, HMI Display, and Power Supply.
3. The system as claimed in claim 1, wherein the processing unit of the hydraulic pressure monitoring system for die manufacturing plants is the ATmega64 MCU Board, which is integrated into both of the motes, it performs local data processing tasks and enables smooth communication between sensors, RF modules, and other components.
4. The system as claimed in claim 1, wherein the TCRFHP_HRENode and RCRFHP_HRENode can reliably communicate wirelessly thanks to the CC2500 RF Module, which is also included in both of the motes, this allows real-time sensor data to be transmitted, which is crucial for hydraulic pressure monitoring in die manufacturing facilities.
5. The system as claimed in claim 1, wherein to accurately monitor the extrusion processes in die production plants, the Liquid Pressure Sensor coupled to the TCRFHP_HRENode is utilized to measure and provide real-time data on hydraulic pressure.
6. The system as claimed in claim 1, wherein the temperature Sensor, which is likewise connected to the TCRFHP_HRENode, is utilized to supply temperature data in real time, facilitating thorough environmental condition monitoring and aiding in the evaluation of hydraulic ram extrusion procedures in die production facilities as a whole.
7. The system as claimed in claim 1, wherein the RCRFHP_HRENode's integrated ESP01 WiFi Board is used to enable smooth connectivity to the cloud server, allowing the transfer of processed sensor data and supporting real-time analytics, monitoring, and trend analysis display via an HMI Display and a customized web dashboard for die manufacturing plant operators.
8. The system as claimed in claim 1, wherein to improve situational awareness in die production facilities, the HMI Display interfaced on RCRFHP_HRENode is utilized to give operators real-time visualizations, critical alerts, and trend analysis obtained from the hydraulic pressure monitoring system.

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