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BONDED BODY SUBSTRATE FOR POWER MODULES AND SUBSTRATE WITH HEAT SINK FOR POWER MODULES
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Abstract
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BONDED BODY SUBSTRATE FOR POWER MODULES AND SUBSTRATE WITH HEAT SINK FOR POWER MODULES
PCT NATIONAL PHASE APPLICATION
Published
Filed on 14 September 2015
Patent Information
| Application ID | 8369/DELNP/2015 |
| Date of Application | 14/09/2015 |
Documents
| Name | Date |
|---|---|
| 8369-delnp-2015-Correspondence Others-(02-02-2016).pdf | 02/02/2016 |
| 8369-delnp-2015-Form-3-(02-02-2016).pdf | 02/02/2016 |
| Description(Complete) [27-11-2015(online)].pdf | 27/11/2015 |
| Form 13 [27-11-2015(online)].pdf | 27/11/2015 |
| Marked Copy [27-11-2015(online)].pdf | 27/11/2015 |
| 8369-delnp-2015-Correspondence Others-(30-09-2015).pdf | 30/09/2015 |
| 8369-delnp-2015-Form-1-(30-09-2015).pdf | 30/09/2015 |
| 8369-DELNP-2015.pdf | 19/09/2015 |
| 8369-delnp-2015-Correspondence Others-(17-09-2015).pdf | 17/09/2015 |
| 8369-delnp-2015-Others-(17-09-2015).pdf | 17/09/2015 |
| Description(Complete) [14-09-2015(online)].pdf | 14/09/2015 |
| Drawing [14-09-2015(online)].pdf | 14/09/2015 |
| Form 3 [14-09-2015(online)].pdf | 14/09/2015 |
| Form 5 [14-09-2015(online)].pdf | 14/09/2015 |
