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ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
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Abstract
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ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
CONVENTIONAL APPLICATION
Published
Filed on 22 September 2021
Patent Information
| Application ID | 202144042939 |
| Date of Application | 22/09/2021 |
Documents
| Name | Date |
|---|---|
| 202144042939-FORM 3 [22-03-2022(online)].pdf | 22/03/2022 |
| 202144042939-FORM-26 [22-12-2021(online)].pdf | 22/12/2021 |
| 202144042939-COMPLETE SPECIFICATION [22-09-2021(online)].pdf | 22/09/2021 |
| 202144042939-DECLARATION OF INVENTORSHIP (FORM 5) [22-09-2021(online)].pdf | 22/09/2021 |
