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APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE

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APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE

DIVISIONAL ORDINARY APPLICATION

Published

date

Filed on 20 October 2020

Patent Information

Application ID202042045703
Date of Application20/10/2020

Documents

NameDate
202042045703-Proof of Right [17-10-2022(online)].pdf17/10/2022
202042045703-ABSTRACT [29-08-2022(online)].pdf29/08/2022
202042045703-CLAIMS [29-08-2022(online)].pdf29/08/2022
202042045703-FER_SER_REPLY [29-08-2022(online)].pdf29/08/2022
202042045703-FORM 3 [29-08-2022(online)].pdf29/08/2022
202042045703-Information under section 8(2) [29-08-2022(online)].pdf29/08/2022
202042045703-OTHERS [29-08-2022(online)].pdf29/08/2022
202042045703-FER.pdf28/02/2022
202042045703-FORM 3 [19-04-2021(online)].pdf19/04/2021
202042045703-FORM 18 [21-01-2021(online)].pdf21/01/2021
202042045703-FORM-26 [16-12-2020(online)].pdf16/12/2020
202042045703-COMPLETE SPECIFICATION [20-10-2020(online)].pdf20/10/2020
202042045703-DECLARATION OF INVENTORSHIP (FORM 5) [20-10-2020(online)].pdf20/10/2020
202042045703-DRAWINGS [20-10-2020(online)].pdf20/10/2020
202042045703-FORM 1 [20-10-2020(online)].pdf20/10/2020

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