A DESIGN OF PENTAGONAL SHAPED MINI CHANNEL HEAT SINK

Abstract

A Design of Pentagonal Shaped Mini Channel Heat Sink Abstract The Pentagonal Shaped Mini Channel Heat Sink (001) is designed to enhance heat dissipation in electronic systems. It features pentagonal channels (05) strategically arranged to maximize heat transfer between nanofluids and De-ionized water by increasing the.surface area for heat transfer Oval slots (06) at the channel ends enable multiple fluid flow passes, improving the residence time and cooling efficiency. Compared to traditional heat sinks, this design reduces pressure drop and pumping power requirements through optimized fluid flow paths. The rhombus shaped mini passages (07) provide smooth flow of De ionized water efficiently absorbs heat from the nanofluids. Controlled turbulence in the pentagonal channels boosts the convective heat transfer coefficient ensuring superior cooling performance. The compact nature of this heat sink makes it suitable for modern electronics where space constraints are critical, sets a new standard for high performance thermal management technology with enhanced fluid dynamics apd heat transfer efficiency.

Specification

FORM 2
THE PATENT ACT 1970
(39 OF 1970)
&
The Patent Rules, 2003
PROVISIONAL/COMPLETE SPECIFICATION
(See Section 10 and rule 13)

1.TITLE OF THE INVENTION
A Design of Pentagonal Shaped Mini Channel Heat Sink______________________________
2A.PPLICANTS (S)
(a) NAME: 1. Easwari Engineering College
(b) NAT(ONALITY: INDIAN
(c) ADDRESS: 1. Easwari Engineering College, Bharathi Salai, Ramapuram, Chennai - 600089
3P.REAMBLE TO THE DESCRIPTION:
PROVISIONAL
The-following-specification-describes-the
invention '
COMPLETE
The following specification particularly describes
the invention and the manner in which it is to be
performed.
20^lov-2024/138609/202441090001/Form 2(Title Page)
4. DESCRIPTION (Description shall start from next page.)
ATTACHED
5. CLAIMS (not-applicable-fonprovisional-specificatiom Claims should start with the preamble
"l/we claim" on separate page)
ATTACHED
6. DATE AND SIGNATURE (to be given at the end of last page of specification)
ATTACHED
7. ABSTRACT OF THE INVENTION (to be given along with complete specification on separate
page)
ATTACHED
Note:
*Repeat boxes in case of more than one entry.
*To be signed by the applicant(s) or by authorized registered patent agent.
*Name of the applicant should be given in full, family name in the beginning.
*Complete address of the applicant should be given stating the postal index no./code, state
and country.
*Strike out the column which is/are not applicable

Field of the Invention:
[0001] The present invention pertains to the field of thermal management and heat dissipation technologies, specifically focusing on advanced cooling solutions for electronic systems. The invention introduces a pentagonal-shaped mini-channel heat sink, which integrates innovative fluid dynamics and heat transfer principles to optimize thermal performance. This heat sink is designed for applications in high-performance electronic devices, where effective cooling is essential to maintain operational stability and prolong component durability. The invention addresses the challenges of efficient heat dissipation in modern electronics, including processors, graphic cards, laptops, telecommunications equipment, and other compact systems that generate substantial heat during operation. It is particularly suited for next generation electronics with dense power requirements, where traditional cooling methods are insufficient due to space constraints and increasing thermal loads making it a versatile and essential innovation in the field of thermal engineering.

Background of the Invention
[0002] The electronic systems advance in complexity and processing power; effective
thermal management becomes a critical issue. Traditional mini channel heat sinks often utilize rectangular or circular channels as the standard in heat dissipation technologies. However, these conventional designs present significant limitations, particularly in handling the higher thermal demands of modem electronic components. These limitations include inefficiencies in fluid flow, suboptimal heat transfer, and excessive pressure drops that compromise the system overall thermal management efficiency. In traditional mini channel heat sinks, the channel shape and arrangement are typically limited to rectangular or circular geometries. While these designs provide adequate surface areas for heat transfer, they fall short in maximizing contact between the cooling fluid and the heated surfaces. As a result, heat transfer rates are lower, leading to less efficient cooling.

[0003] Traditional heat sinks often exhibit higher pressure drops due to the abrupt changes in fluid direction and channel geometry. These pressure drops not only increase the systems pumping power requirements but also reduce the overall fluid flow efficiency, which is crucial for effective heat dissipation. Conventional channel designs fail to 30 optimize fluid flow dynamics. In many cases, laminar flow occurs that limits the turbulence needed for effective convective heat transfer. Without sufficient turbulence, the boundary layers in the fluid form more readily, reducing the overall heat, transfer coefficient. Due to the inefficient flow paths and higher pressure drops, traditional mini channel heat sinks require more pumping power to maintain the desired fluid flow. This increased energy demand not only raises operational costs but also adds to the complexity of the cooling system design. In traditional designs, the fluid residence time inside the channels is not always optimized. This leads to ineffective heat absorption, as the fluid may exit the system before sufficient heat transfer occurs. This limitation becomes more problematic as power densities in electronic systems continue to increase. To address the inherent drawbacks of traditional mini channel heat sinks, this invention introduces a pentagonal shaped mini channel heat sink that causes several advantages over conventional designs. These enhancements are directly related to the geometric configuration and the strategic arrangement of fluid flow paths, offering an optimized thermal management solution.

[0004] The pentagonal channel shape significantly increases the surface area available for heat exchange between the cooling fluid (de ionized water) and the nanofluids. Compared to traditional rectangular or circular channels, the pentagonal configuration creates more contact points between the fluid and the channel walls, enhancing heat absorption and dissipation. One of the key innovations in the pentagonal-shaped mini channel heat sink is the oval-shaped slots at the ends of each channel. These slots provide smoother transitions for the nanofluids to flow through the multiple channel layers. The result is a reduction in pressure drop compared to traditional designs, where sharp turns and abrupt geometric
changes often hinder fluid flow. The streamlined design ensures that the fluid flow remains consistent, reducing the need for high pumping power.

[0005] The pentagonal shaped channels integrated with rhombus shaped mini passages allow more controlled fluid flow. The design induces the right amount of turbulence inside the channels, preventing the formation of boundary layers that typically reduce heat transfer efficiency in laminar flow conditions. This controlled turbulence enhances the convective heat transfer coefficient, making the system more effective at dissipating heat. Due to the optimized flow paths and reduced pressure drop, the pentagonal mini channel heat sink requires less pumping power to maintain effective fluid circulation. This leads to lower operational costs and reduces the energy footprint of the thermal management system. This makes the heat sink more sustainable and efficient for high-performance electronic devices. The design ensures that nanofluids and de ionized water remain in contact with the heated surfaces for longer periods, optimizing heat absorption. The multiple flow passes created by the oval-shaped slots increase the residence time of the
cooling fluids allowing for more effective heat transfer. This is particularly beneficial in
high density electronic systems, where quick and efficient heat dissipation is crucial to
maintaining optimal performance.

[00061 The pentagonal shaped mini channel heat sink is designed to be compact, making it
suitable for applications having limited space. Despite its small size, the heat sink offers
superior thermal performance, making it ideal for modern electronics such as laptops,
processors, and high-performance computing systems. Additionally, its adaptability allows
it to be used in various configurations depending on the specific thermal requirements of
the system. The pentagonal-shaped mini-channel heat sink offers a robust solution to the
heat dissipation challenges of modem electronics, setting a new standard for efficient,
compact, and sustainable thermal management systems

Objective of the Invention
[0007] The primary objective of the invention is to provide a more efficient heat sink design by introducing a pentagonal-shaped mini-channel configuration to maximize surface area for heat exchange. Minimizing frictional losses, pumping power, and pressure drop. Optimizing the flow of heat transfer fluids like nanofluids and de ionized water through the unique arrangement of pentagonal and rhombus shaped passages. Ensuring
compatibility with compact electronic systems where space and thermal efficiency are
critical.

Summary of the Invention
[0008] This patent discloses a pentagonal shaped mini channel heat sink designed to optimize thermal dissipation in electronic systems. The heat sink comprises an array of pentagonal shaped channels that facilitate efficient fluid flow, maximizing the heat transfer rate between the heated surfaces and the cooling fluid. The pentagonal channels are arranged in layers, with oval-shaped slots at the ends to provide a controlled flow of nanofluids through multiple passes. De ionized water enters through a separate rhombus shaped mini passage, effectively cooling the nanofluids by absorbing heat. The combination of geometrically optimized channels and fluid flow paths results in improved heat dissipation and lower energy consumption for pumping fluids.

Brief Description of the Drawing
[0009] The drawings deliberating the specification of parts detailed the embodiment of inventions and description provides the deep insight of the inventions
[0010] Figure 1 illustrates the complete design of the pentagonal shaped mini channel heat sink, showing the inlet and outlet for both de ionized water and nanofluids.
[0011] Figure 2 depicts the array arrangement of pentagonal shaped channels in the heat sink.
[0012] Figure 3 shows the shell structure of the pentagonal shaped channel, emphasizing the geometrical contours designed for optimal heat transfer.
[0013] Figure 4 provides a top view of the heat sink with open end panels, highlighting the fluid flow paths.

Detailed Description of the Invention
[0014] The embodiment of the present invention shows the Pentagonal Shaped MiniChannel Heat Sink (001) is a novel thermal management solution engineered to enhance heat dissipation in high-performance electronic systems. This innovative design addresses the limitations of conventional heat sinks by utilizing pentagonal shaped mini channels (05) and rhombus shaped mini passages (07) to maximize heat transfer and fluid flow
efficiency. The configuration optimizes heat exchange between nanofluids and De ionized water, improving cooling performance while reducing energy consumption and pressure drop.

[0015] The present invention said Pentagonal Shaped Mini Channel Heat Sink (001) consists of a base plate (08) in direct thermal contact with heat-generating components. Extending from the base plate are pentagonal shaped mini channels (05), which form the primary flow path for nanofluids. These channels are designed with a unique pentagonal geometry, providing a larger surface area for heat exchange compared to traditional rectangular or circular channels. The increased surface contact allows for more efficient heat absorption as the nanofluids flow through the channels.

[0016] The embodiment of present invention heat sink design also incorporates rhombus shaped mini passages (07), which facilitate the flow of De ionized water. These passages run parallel to the pentagonal channels, ensuring that the De ionized water can efficiently absorb heat transferred from the nanofluids. The combination of these passages creates an effective cooling system capable of handling higher heat loads.

[0017] The nanofluids enter the heat sink through a strategically positioned inlet (03), flowing through the pentagonal shaped channels (05). As the nanofluids pass through three channels in a three-pass manner, they absorb heat from the base (08) panel wall, where the electronic component is mounted. The nanofluids exit the heat sink via an outlet (04) at the opposite end after transferring heat to the De ionized water flowing in the adjacent passages.

[0018] De ionized water enters the heat sink through a separate inlet (01) into the rhombus shaped mini passages (07), flowing parallel to the pentagonal channels. As it flows through these passages, the De ionized water absorbs heat from the channel walls where the nanofluids are contained. After the heat exchange, the De ionized water exits the heat sink through its designated outlet (02). The placement of inlets and outlets ensures an efficient flow of both fluids, maximizing heat dissipation while maintaining low pressure drop.

[0019] The unique pentagonal shaped mini channels (05) are designed to induce controlled turbulence in the nanofluids, which improves convective heat transfer. This turbulence prevents the formation of boundary layers that can reduce heat transfer efficiency in laminar flow conditions. The controlled turbulence enhances the convective heat transfer coefficient, ensuring that the nanofluids absorb maximum heat as they flow through the channels. Similarly, the rhombus shaped mini passages (07) are optimized for smooth flow of De ionized water, which absorbs heat from the nanofluid through the channel walls. The rhombus shape reduces turbulence and pressure drop, ensuring efficient heat absorption without excessive energy consumption for fluid pumping.

[0020] The heat sink also features oval shaped slots (06) at the ends of the pentagonal channels, allowing the nanofluids to pass through multiple layers of channels. This increases the fluid residence time within the heat sink, improving heat absorption and overall cooling performance. The base plate and channels are made from copper materials with high thermal conductivity, which enhance the heat conduction from the electronic component to the cooling fluids. These materials ensure that the heat sink can efficiently dissipate large amounts of heat, making it suitable for high-performance electronic systems.

[0021] The pentagonal shaped mini channel heat sink (001) offers several distinct advantages over conventional rectangular or circular designs. The pentagonal geometry increases the surface area available for heat exchange, maximizing heat transfer capacity of the nanofluids. The oval shaped slots (06) and smooth flow passages reduce pressure 5 drop, ensuring efficient fluid flow without requiring excessive pumping power. The optimized fluid flow paths minimize energy consumption for pumping the cooling fluids, reducing operational costs. The layered arrangement of the channels allows the heat sink to be compact and space efficient, making it ideal for applications where space is limited, such as laptops and high-performance processors. The combination of pentagonal shaped 10 channels (05) and rhombus shaped passages (07) ensures superior thermal management, preventing hotspots and ensuring consistent cooling performance across all components. This heat sink is ideal for a wide range of high-performance electronic devices, including processors, GPUs, telecommunications equipment, and data center cooling systems. Its compact size and superior thermal performance make it suitable for applications where 15 space and heat dissipation efficiency are critical. The design can also be applied in automotive electronics and industrial machinery for reliable thermal management.

LIST OF REFERENCE NUMERALS
001 - Pentagonal Shaped Mini-Channel Heat Sink
01 - Inlet of De Ionized Water
02 - Outlet of De Ionized Water
03 - Inlet of Nanofluids
04 - Outlet of Nanofluids
05 - Pentagonal shaped channels
06 - Oval shaped slots
07 - Rhombus shaped mini passages

Claims
I/We claim

1. A pentagonal-shaped mini-channel heat sink (001) designed for efficient heat dissipation, comprising:
• A base plate in thermal contact with electronic components.
• A series of pentagonal shaped channels (05) arranged in layers, with oval slots at each end.
• Rhombus shaped mini passages (07) facilitate the flow of de ionized water.

2. The heat sink of claim 1, wherein the pentagonal channels (05) are designed to
maximize the contact area between the cooling fluid and the heated surface.

3. The heat sink of claim 1, wherein the oval slots (06) enable nanofluids to pass through multiple layers, increasing the fluid's residence time for more effective heat absorption.

4. The heat sink of claim 1, wherein the rhombus shaped mini passages (07) allows De ionized water to flow and absorb heat from the nanofluids.

5. The heat sink of claim 1, wherein the inlets (01) and outlets (02) for De ionized water are strategically positioned for optimal flow control and heat dissipation.

6. The heat sink of claim 1, wherein the inlets (03) and outlets (04) for nanofluids are positioned at upper right side and lower left side of the heat sink it allows three pass flow for better heat dissipation.

SIGNATURE OF THE APPLICANT
Dated this 15th November of 2024

Documents