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ADVANCED SELF-HEALING COMPOSITE MATERIALS FOR AEROSPACE STRUCTURAL COMPONENTS

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ADVANCED SELF-HEALING COMPOSITE MATERIALS FOR AEROSPACE STRUCTURAL COMPONENTS

ORDINARY APPLICATION

Published

date

Filed on 15 November 2024

Abstract

The present invention relates to advanced self-healing composite materials for aerospace structural components. The composite material comprises a polymeric matrix embedded with microcapsules containing a healing agent, such as an epoxy or polyurethane-based resin, and a catalyst that initiates polymerization upon capsule rupture. The material further includes a reinforcing fiber network, such as carbon or aramid fibers, to provide high strength and stiffness. The self-healing mechanism is activated when the material experiences damage, releasing the healing agent to seal cracks and restore the mechanical properties. Optional integrated sensors monitor the damage and healing process in real-time. The invention offers improved durability, reduced maintenance, and extended operational life for aerospace components subjected to extreme conditions.

Patent Information

Application ID202431088601
Invention FieldPOLYMER TECHNOLOGY
Date of Application15/11/2024
Publication Number47/2024

Inventors

NameAddressCountryNationality
Dr. Swagatika MishraAssistant Professor, Veer Surendra Sai University of Technology, Burla, Sambalpur, Pin:768018, Odisha, India.IndiaIndia
Dr. Asnit GangwarAssistant Professor, Shri Vishnu Engineering College for Women, Bhimavaram, Pin: 534202, Andhra Pradesh, India.IndiaIndia
Dr. Amit Kumar MeharAssociate Professor, Raghu Engineering College (Autonomous), Vishakhapatnam, Dakamarri, Bheemunipatnam, Mandal, Vishakhapatnam, Pin:531162, Andhra Pradesh, India.IndiaIndia
Dr. M. ManickamAssistant Professor, Department of Physics, Dr.SNS Rajalakshmi College of Arts and Science, Coimbatore, Pin: 641049, Tamilnadu, India.IndiaIndia
Dr. D. PradhabhanAssistant Professor and Head, Department of Physics, Dr.SNS Rajalakshmi College of Arts and Science, Coimbatore, Pin: 641 049, Tamilnadu, India.IndiaIndia
Mr. R. KarthickAssistant Professor, Department of Mechanical Engineering, Rajalakshmi Institute of Technology, Bangalore Highway Road, Kuthampakkam, Poonamalle, Chennai, Pin:600124, Tamilnadu, India.IndiaIndia
Dr. Y. Rameswara ReddyAssistant Professor, Department of Mechanical Engineering, JNTUA College of Engineering Pulivendula, Kadapa, Pin:516390, Andhra Pradesh, India.IndiaIndia
Dr. Deepak Kumar B NAssistant Professor, Dayananda Sagar Academy of Technology and Management, Opp. Art of Living, Udayapura, Kanakapura Road, Bengaluru, Pin:560082, Karnataka, India.IndiaIndia
Dinesh Kumar BajajAssistant Professor, MIT Art, Design and Technology University, Pune, Pin: 412201, Maharashtra, India.IndiaIndia
Dr. Sudhangshu ChakrabortyAssistant Professor, Department of BS& HU (Physics), Asansol Engineering College, Vivekananda Sarani, Asansol, Pin: 713305, West Bengal, India.IndiaIndia

Applicants

NameAddressCountryNationality
Dr. Swagatika MishraAssistant Professor, Veer Surendra Sai University of Technology, Burla, Sambalpur, Pin:768018, Odisha, India.IndiaIndia
Dr. Asnit GangwarAssistant Professor, Shri Vishnu Engineering College for Women, Bhimavaram, Pin: 534202, Andhra Pradesh, India.IndiaIndia
Dr. Amit Kumar MeharAssociate Professor, Raghu Engineering College (Autonomous), Vishakhapatnam, Dakamarri, Bheemunipatnam, Mandal, Vishakhapatnam, Pin:531162, Andhra Pradesh, India.IndiaIndia
Dr. M. ManickamAssistant Professor, Department of Physics, Dr.SNS Rajalakshmi College of Arts and Science, Coimbatore, Pin: 641049, Tamilnadu, India.IndiaIndia
Dr. D. PradhabhanAssistant Professor and Head, Department of Physics, Dr.SNS Rajalakshmi College of Arts and Science, Coimbatore, Pin: 641 049, Tamilnadu, India.IndiaIndia
Mr. R. KarthickAssistant Professor, Department of Mechanical Engineering, Rajalakshmi Institute of Technology, Bangalore Highway Road, Kuthampakkam, Poonamalle, Chennai, Pin:600124, Tamilnadu, India.IndiaIndia
Dr. Y. Rameswara ReddyAssistant Professor, Department of Mechanical Engineering, JNTUA College of Engineering Pulivendula, Kadapa, Pin:516390, Andhra Pradesh, India.IndiaIndia
Dr. Deepak Kumar B NAssistant Professor, Dayananda Sagar Academy of Technology and Management, Opp. Art of Living, Udayapura, Kanakapura Road, Bengaluru, Pin:560082, Karnataka, India.IndiaIndia
Dinesh Kumar BajajAssistant Professor, MIT Art, Design and Technology University, Pune, Pin: 412201, Maharashtra, India.IndiaIndia
Dr. Sudhangshu ChakrabortyAssistant Professor, Department of BS& HU (Physics), Asansol Engineering College, Vivekananda Sarani, Asansol, Pin: 713305, West Bengal, India.IndiaIndia

Specification

Description:The embodiments of the present invention generally relates to the field of advanced materials engineering, specifically to self-healing composite materials designed for use in aerospace structural components. More particularly, it pertains to composite materials that autonomously repair damage such as micro-cracks, ensuring enhanced durability, safety, and performance of aerospace structures subjected to extreme operational environments.
BACKGROUND OF THE INVENTION
The following description of related art is intended to provide background information pertaining to the field of the disclosure. This section may include certain aspects of the art that may be related to various features of the present disclosure. However, it should be appreciated that this section be used only to enhance the understanding of the reader with respect to the present disclosure, and not as admissions of prior art.

Aerospace structures are subjected to demanding conditions that include high levels of mechanical stress, temperature fl , Claims:1. A method for manufacturing self-healing composite materials for aerospace applications, comprising:
preparing a polymeric matrix embedded with microcapsules containing a healing agent;
dispersing a polymerization catalyst within the matrix;
laminating the matrix with a reinforcing fiber network;
curing the composite material under controlled conditions to form the self-healing structure.

2. The method of claim 1, wherein the microcapsules are fabricated using an interfacial polymerization technique to ensure controlled size and shell thickness.

3. The method of claim 1, wherein the curing conditions involve temperatures between 120°C and 180°C to achieve optimal mechanical properties.

4. The method of claim 2, wherein the microcapsules are produced using an interfacial polymerization technique, resulting in microcapsules with a uniform size distribution and controlled shell thickness to ensure the efficient release of the healing agent upon damage.

5. The method of claim 2, wherein the polymeric matrix

Documents

NameDate
202431088601-COMPLETE SPECIFICATION [15-11-2024(online)].pdf15/11/2024
202431088601-DECLARATION OF INVENTORSHIP (FORM 5) [15-11-2024(online)].pdf15/11/2024
202431088601-DRAWINGS [15-11-2024(online)].pdf15/11/2024
202431088601-FORM 1 [15-11-2024(online)].pdf15/11/2024
202431088601-FORM-9 [15-11-2024(online)].pdf15/11/2024
202431088601-REQUEST FOR EARLY PUBLICATION(FORM-9) [15-11-2024(online)].pdf15/11/2024

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