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ADDRESSING, INTERLEAVE, WEAR LEVELING, AND INITIALIZATION SCHEMES FOR DIFFERENT CHIP ENABLES AND MEMORY ARRAYS OF DIFFERENT TYPES
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Abstract
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ADDRESSING, INTERLEAVE, WEAR LEVELING, AND INITIALIZATION SCHEMES FOR DIFFERENT CHIP ENABLES AND MEMORY ARRAYS OF DIFFERENT TYPES
ORDINARY APPLICATION
Published
Filed on 13 January 2015
Patent Information
| Application ID | 126/MUM/2015 |
| Date of Application | 13/01/2015 |
Documents
| Name | Date |
|---|---|
| 126-MUM-2015-CORRESPONDENCE(24-4-2015).pdf | 11/08/2018 |
| 126-MUM-2015-FORM 26(24-4-2015).pdf | 11/08/2018 |
| Drawings.pdf | 11/08/2018 |
| Form 3.pdf | 11/08/2018 |
| Form 5.pdf | 11/08/2018 |
| IP229793 (Certified Copy).pdf | 11/08/2018 |
| Specification.pdf | 11/08/2018 |
