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A METHOD FOR PREVENTING PLASMA DAMAGES TO SURFACES OF SILICON WAFER DURING PLASMA DEPOSITION PROCESS IN A PLASMA CHAMBER
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A METHOD FOR PREVENTING PLASMA DAMAGES TO SURFACES OF SILICON WAFER DURING PLASMA DEPOSITION PROCESS IN A PLASMA CHAMBER
ORDINARY APPLICATION
Published
Filed on 29 April 2015
Patent Information
| Application ID | 473/KOL/2015 |
| Date of Application | 29/04/2015 |
Documents
| Name | Date |
|---|---|
| 473-KOL-2015-Correspondence to notify the Controller [17-11-2023(online)].pdf | 17/11/2023 |
| 473-KOL-2015-US(14)-HearingNotice-(HearingDate-20-11-2023).pdf | 18/10/2023 |
| 473-KOL-2015-DRAWING [21-01-2019(online)].pdf | 21/01/2019 |
| 473-KOL-2015-FER_SER_REPLY [21-01-2019(online)].pdf | 21/01/2019 |
| 473-KOL-2015-OTHERS [21-01-2019(online)].pdf | 21/01/2019 |
| 473-KOL-2015-FER.pdf | 31/07/2018 |
| 473-KOL-2015-Correspondence-180515.pdf | 01/09/2015 |
| 473-KOL-2015-Form 1-180515.pdf | 01/09/2015 |
| DW.pdf | 10/07/2015 |
| F2.pdf | 10/07/2015 |
| F3.pdf | 10/07/2015 |
| FOA.pdf | 10/07/2015 |
| GPA.pdf | 10/07/2015 |
