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A METHOD OF ASSEMBLING VCSEL CHIPS ON A SUB MOUNT

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A METHOD OF ASSEMBLING VCSEL CHIPS ON A SUB MOUNT

PCT NATIONAL PHASE APPLICATION

Published

date

Filed on 26 March 2014

Patent Information

Application ID2297/CHENP/2014
Date of Application26/03/2014

Documents

NameDate
2297-CHENP-2014-IntimationOfGrant24-10-2019.pdf24/10/2019
2297-CHENP-2014-PatentCertificate24-10-2019.pdf24/10/2019
Abstract_Granted 323584_24-10-2019.pdf24/10/2019
Claims_Granted 323584_24-10-2019.pdf24/10/2019
Description_Granted 323584_24-10-2019.pdf24/10/2019
Drawings_Granted 323584_24-10-2019.pdf24/10/2019
Marked up Claims_Granted 323584_24-10-2019.pdf24/10/2019
2297-CHENP-2014-Information under section 8(2) (MANDATORY) [15-10-2019(online)].pdf15/10/2019
Correspondence by Agent_Assignment_30-07-2019.pdf30/07/2019
2297-CHENP-2014-PETITION UNDER RULE 137 [24-07-2019(online)].pdf24/07/2019
2297-CHENP-2014-Proof of Right (MANDATORY) [24-07-2019(online)]-1.pdf24/07/2019
2297-CHENP-2014-Proof of Right (MANDATORY) [24-07-2019(online)].pdf24/07/2019
2297-CHENP-2014-ABSTRACT [23-07-2019(online)].pdf23/07/2019
2297-CHENP-2014-CLAIMS [23-07-2019(online)].pdf23/07/2019
2297-CHENP-2014-COMPLETE SPECIFICATION [23-07-2019(online)].pdf23/07/2019
2297-CHENP-2014-CORRESPONDENCE [23-07-2019(online)].pdf23/07/2019
2297-CHENP-2014-DRAWING [23-07-2019(online)].pdf23/07/2019
2297-CHENP-2014-FER_SER_REPLY [23-07-2019(online)].pdf23/07/2019
2297-CHENP-2014-FORM-26 [23-07-2019(online)].pdf23/07/2019
2297-CHENP-2014-OTHERS [23-07-2019(online)].pdf23/07/2019
2297-CHENP-2014-PETITION UNDER RULE 137 [23-07-2019(online)].pdf23/07/2019
2297-CHENP-2014-FORM 13 [20-06-2019(online)].pdf20/06/2019
2297-CHENP-2014-FER.pdf24/01/2019
abstract 2297-CHENP-2014.jpg20/11/2014
DRAWINGS.pdf20/11/2014
2011p01005wo - spec.pdf02/04/2014
FORM 3.pdf02/04/2014
FORM 5.pdf02/04/2014
2297-CHENP-2014.pdf27/03/2014
GPOA 31-07-2013.PDF.pdf31/07/2013
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