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A DEVICE FOR SOLDERING ELECTRONIC COMPONENTS BY REFLOW SOLDERING TECHNIQUE AND THE PROCESS THEREOF

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A DEVICE FOR SOLDERING ELECTRONIC COMPONENTS BY REFLOW SOLDERING TECHNIQUE AND THE PROCESS THEREOF

ORDINARY APPLICATION

Published

date

Filed on 13 October 2020

Patent Information

Application ID202011044614
Date of Application13/10/2020

Documents

NameDate
202011044614-Correspondence to notify the Controller [12-01-2024(online)].pdf12/01/2024
202011044614-US(14)-HearingNotice-(HearingDate-25-01-2024).pdf21/12/2023
202011044614-CLAIMS [04-06-2022(online)].pdf04/06/2022
202011044614-FER_SER_REPLY [04-06-2022(online)].pdf04/06/2022
202011044614-FER.pdf04/01/2022
202011044614-Correspondence-300621.pdf19/10/2021
202011044614-OTHERS-300621.pdf19/10/2021
202011044614-Power of Attorney-300621.pdf19/10/2021
202011044614-ENDORSEMENT BY INVENTORS [01-10-2021(online)].pdf01/10/2021
202011044614-FORM 3 [08-01-2021(online)].pdf08/01/2021
202011044614-FORM 18 [07-01-2021(online)].pdf07/01/2021
202011044614-COMPLETE SPECIFICATION [13-10-2020(online)].pdf13/10/2020
202011044614-FORM 1 [13-10-2020(online)].pdf13/10/2020
202011044614-FORM-9 [13-10-2020(online)].pdf13/10/2020
202011044614-POWER OF AUTHORITY [13-10-2020(online)].pdf13/10/2020
202011044614-REQUEST FOR EARLY PUBLICATION(FORM-9) [13-10-2020(online)].pdf13/10/2020
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